If you use lasers in material "micro processing" applications – such as drilling via holes in PCBs, OLED display "lift-off", cutting of smartphone cover glass – you already know how difficult the challenges are.
The often delicate combination of laser parameters – ultra short pulse duration, high repetition rate, perhaps short wavelength among others – can enable new and innovative processes, but they can also cause unexpected damage to the measurement tools you are trying to use to keep the process stable.
